Tracewell Systems

Tracewell utilizes a unique toolbox of capabilities for thermal mitigation, as well as size and weight reduction, along with ruggedization techniques and power conditioning to exceed customer expectations.

Tracewell distinguishes itself by capitalizing on our streamlined Smart Solutions Process™ (SSP). The SSP helps us define the gap between what you need and what you have. We then work to create a path to solve the problem, providing innovative solutions with predictable results and building products that are even better than you imagined they could be. That’s the Tracewell Difference.

The value we add provides you with an excellent return on your investment and creates a long-term, successful partnership with Tracewell Systems. 

Smart Solutions Process (SSP) Provides a Unique Approach for Complex Problems

Tracewell Systems uses a unique approach to solving complex packaging problems called the Smart Solutions Process (SSP), as illustrated below.

The outer circle represents your requirements. The second circle with the arrows represents the Tracewell Smart Solutions Process. We take your requirements and put them through our SSP—visualizing, conceptualizing, designing, prototyping, validating, fabricating and integrating. 

The third circle represents the outcome utilizing the Smart Solutions tools. The result is a product that has a lower cost of manufacturing and ownership, better power management, improved cooling, less weight, employs simple BOM management and a proven industry-leading design.

 

 

Utilizing the SSP process and a holistic systems approach, Tracewell products offer:

• Increased efficiency
• Compact, light weight, modular systems
• Improved cooling
• Higher power density
• Increased reliability with more mean time between failure
• Better serviceability
• Reduced cost